A digital thread approach to engineering encourages collaboration among engineering disciplines and leads to a simulation-driven digital twin. By adopting a digital thread approach to engineering, ...

The main purpose of the event is to discuss the outcomes of the coordinated research project entitled “Testing and Simulation for Advanced Technology and Accident Tolerant Fuels (ATF-TS)” to assess ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Treo's ROIC process technology leverages high-density, low-power architecture for mission-critical aerospace, defense, security, and scientific applicationsSCOTTSDALE, Ariz., Oct. 28, 2025 (GLOBE NEWS ...

SAN DIEGO, Sept. 29, 2025 (GLOBE NEWSWIRE) -- Kratos Defense & Security Solutions, Inc. (Nasdaq: KTOS), a technology company in Defense, National Security and Global Markets, has successfully ...

Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing need for silicon that can power consumer Macs and enhance ...